Reforming Semiconductor Package Design Analysis through Workflow Automation

Read on to learn more about Soliton’s role in automating the FMEA for semiconductor package design (mechanical assembly), thereby reducing repeated engineering effort and improving the overall utilization of simulation servers.

A semiconductor chip’s lifecycle is a complex multistage process that requires the chip to be subjected to several rigorous tests involving dedicated teams before being released to the market. In the specific context of semiconductor packaging, the chip, in its initial design phase, undergoes thorough simulation and mechanical analyses by R&D engineers before advancing through the semiconductor lifecycle.  

Customer’s Hurdles with the Existing Workflow 

Analyses of semiconductor chip packaging involve advanced simulation concepts across multiple applications, running for extended durations and yielding complex results. This process, combined with the steep learning curve of simulation applications, posed challenges for our customer, a prominent semiconductor entity. They were utilizing a 3D modeling application that enabled their R&D engineers to perform mechanical analysis during pre-silicon validation.

They were looking to enhance their overall workflow by automating their manual processes and by organizing the artifacts modularly, in order to improve their operational efficiency. Their current process entailed some setbacks that prompted considerations for improvement in the workflow, which required:

• Streamlining the application interface to minimize the learning curve, lessen dependency on specific software skills for test development, and enable users to perform validation effortlessly.
• Implementing comprehensive workflow automation to minimize manual intervention, improving overall efficiency. 
• Enhancing simulation server utilization to expedite test completion and reduce overall processing time. 
• Organization of workflow artifacts for efficient reuse of design, configuration, and execution files, enabling data retrieval and reuse. 
• Addressing inefficiencies across package configuration, assembly setup, and analysis configuration stages. 
• Resolving the procedural guideline ambiguities to streamline result generation.

Recognizing the areas for improvement in their existing workflow, the customer actively sought a reliable partner to refine, simplify, and streamline the process, thereby prompting a collaboration with Soliton.

Key Outcomes of the Engagement  

This comprehensive application that enhanced the customer’s existing workflow delivered solid value to the process and R&D engineers resulting in the:

Summary 

This collaborative venture between the customer and Soliton revolutionized semiconductor package mechanical analysis through automation and optimization. By streamlining workflows and reducing engineering efforts, Soliton delivered impactful results and insightful design analyses. This success highlights Soliton’s commitment to excellence and strengthens Soliton’s credibility for future collaborations.